View MCP1256_318093.PDF datasheet online --- IC-ON-LINE

Datasheet File OCR Text:

MCP1256/7/8/9
Regulated 3.3V, Low-Ripple Charge Pump with LowOperating Current SLEEP Mode or BYPASS Mode
Features
* Inductorless 1.5x, 2x Boost DC/DC Converter * Output Voltage: 3.3V * High Output Voltage Accuracy: - 3.0% (VOUT Fixed) * Output Current Up To 100 mA * 20 mVPP Output Voltage Ripple * Thermal Shutdown and Short Circuit Protection * Uses Small Ceramic Capacitors * Switching Frequency: 650 kHz * Low-Power SLEEP Mode: MCP1256/7 * BYPASS Mode: MCP1258/9 * Low-Power Shutdown Mode: 0.1 A (Typical) * Shutdown Input Compatible with 1.8V Logic * VIN Range: 1.8V to 3.6V * Soft-Start Circuitry to Minimize Inrush Current * Temperature Range: -40C to +125C * Packaging: - 10-Pin, 3 mm x 3 mm DFN - 10-Pin, MSOP
Description
The MCP1256, MCP1257, MCP1258 and MCP1259 are inductorless, positive regulated charge pump DC/DC converters. The devices generate a regulated 3.3V output voltage from a 1.8V to 3.6V input. The devices are specifically designed for applications operating from 2-cell alkaline, Ni-Cd, or Ni-MH batteries or by one primary lithium MnO2 (or similar) coin cell battery. The MCP1256, MCP1257, MCP1258 and MCP1259 provide high efficiency by automatically switching between 1.5x and 2x boost operation. In addition, at light output loads, the MCP1256 and MCP1257 can be placed in a SLEEP mode, lowering the quiescent current while maintaining the regulated output voltage. Alternatively, the MCP1258 and MCP1259 provide a BYPASS feature connecting the input voltage to the output. This allows for real-time clocks, microcontrollers or other system devices to remain biased with virtually no current being consumed by the MCP1258 or MPC1259. In normal operation, the output voltage ripple is below 20 mVPP at load currents up to 100 mA. Normal operation occurs at a fixed switching frequency of 650 kHz, avoiding interference with sensitive IF bands. The MCP1256 and MCP1258 feature a power-good output that can be used to detect out-of-regulation conditions. The MCP1257 and MCP1259 feature a lowbattery indication that issues a warning if the input voltage drops below a preset voltage threshold. Extremely low supply current and few external parts (4 capacitors) make these devices ideal for small, batterypowered applications. A Shutdown mode is also provided for further power reduction. The devices incorporate thermal and short-circuit protection. Two package offerings are provided: 10-pin MSOP and 10-lead 3 mm x 3 mm DFN. The devices are completely characterized over the junction temperature range of -40C to +125C.
Applications
* * * * Pagers Portable Measurement Instruments Home Automation Products PICmicro(R) MCU Bias
Typical Application
INPUT 1.8V to 3.6V CIN 10 F MCP1256 7V IN VOUT 5 R1 OUTPUT 3.3V COUT 10 F Power-Good Indication
10 SHDN 1 PGOOD C1 1 F 4 C+ 1 8 C1
C2+ C2-
6 3
C2 1 F
ON / OFF
2 SLEEP GND 9
Typical Application with Power-Good Indication
(c) 2006 Microchip Technology Inc.
DS21989A-page 1
MCP1256/7/8/9
Package Pinouts
PGOOD SLEEP C2C1 + VOUT 1 2 3 4 5 MCP1256 10 9 8 7 6 SHDN GND C1 VIN C2 + LBO SLEEP C2 C1+ VOUT 1 2 3 4 5 MCP1257 10 9 8 7 6 SHDN GND C1VIN C2+
PGOOD BYPASS C2C1+ VOUT
1 2 3 4 5
MCP1258
10 9 8 7 6
SHDN GND C1 VIN C2 +
LBO BYPASS C2 C1+ VOUT
1 2 3 4 5
MCP1259
10 9 8 7 6
SHDN GND C1VIN C2+
Functional Block Diagram
C2 VIN C2 + C1 C1 +
840 k
1.5x, 2x Mode Comparator + DQ 650 kHz Osc.
Gate Drives S5,S7 S6 S4 S1,S3,CE
S1
S5
S6
VOUT 840 k Bandgap Ref. 720k GND 480 k CE + Feedback Amplifier S2 S3
S4
S7
VOUT
TABLE 1:
Mode 1.5x 1.5x 2x 2x BYPASS
SWITCH LOGIC
Phase Charging Transfer Charging Transfer -- Oscillator H L H L -- Q L L H H -- S1 H L H L H S2(CE) H L H L L S3 H L H L H S4 L H L H H S5 H L L L H S6 L H H H L S7 H L L L L
Legend: L is Logic Low, H is Logic High
DS21989A-page 2
(c) 2006 Microchip Technology Inc.
MCP1256/7/8/9
1.0 ELECTRICAL CHARACTERISTICS
Notice: Stresses above those listed under "Maximum Ratings" may cause permanent damage to the device. This is a stress rating only and functional operation of the device at those or any other conditions above those indicated in the operational listings of this specification is not implied. Exposure to maximum rating conditions for extended periods may affect device reliability.
Absolute Maximum Ratings
Power Supply Voltage, VIN ...............................................3.8V Voltage on Any Pin w.r.t. GND ................. -0.3V to (VIN+0.3V) Output Short Circuit Duration ................................continuous Storage Temperature Range .........................-65C to +150C Ambient Temperature with Power Applied ....-55C to +125C Maximum Junction Temperature ................................. +150C ESD protection on all pins Human Body Model (1.5 k in Series with 100 pF)....... 2 kV Machine Model (200 pF, No Series Resistance) .............200V
DC CHARACTERISTICS
Electrical Specifications: Unless otherwise indicated, all limits apply for VIN = 1.8V to 3.6V, SHDN = VIN, CIN = COUT = 10 F, C1 = C2 = 1 F, IOUT = 10 mA, TJ = -40C to +125C. Typical values are at TJ = +25C. Parameters ALL DEVICES Supply Voltage Output Voltage Output Voltage Accuracy Output Current VIN VOUT VOUT IOUT(MAX) 1.8 -- -3.0 30 70 100 Short Circuit Current Power Efficiency ISC -- -- -- -- -- -- -- -- -- -- -- -- -- -- Shutdown Input - SHDN SHDN Input Voltage Low SHDN Input Voltage High SHDN Input Leakage Current SHDN Quiescent Current Thermal Shutdown Thermal Shutdown Threshold Thermal Shutdown Hysteresis TJ TJ(HYS) -- -- 160 15 -- -- C C VIL(SHDN) VIH(SHDN) ILK(SHDN) IQ -- 1.4 -- -- -- -- 0.001 0.25 0.4 -- 0.1 2 V V A A VSHDN = 0V, TJ = +25C -- 3.3 0.5 -- -- -- 150 84.5 84.5 76.4 80.1 64.0 67.1 67.5 69.7 76.0 76.7 65.0 71.0 71.6 3.6 -- +3.0 -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- V V % mA mA mA mA % % % % % % % % % % % % % IOUT = 10 mA to IOUT(MAX) 1.8V < VIN < 2.0V 2.0V < VIN < 2.2V 2.2V < VIN < 3.6V VOUT = 0V, VIN = 1.8V to 3.6V VIN = 1.8V, IOUT = 10 mA VIN = 1.8V, IOUT = 50 mA VIN = 2.0V, IOUT = 10 mA VIN = 2.0V, IOUT = 50 mA VIN = 2.4V, IOUT = 10 mA VIN = 2.4V, IOUT = 50 mA VIN = 2.4V, IOUT = 100 mA VIN = 2.8V, IOUT = 10 mA VIN = 2.8V, IOUT = 50 mA VIN = 2.8V, IOUT = 100 mA VIN = 3.0V, IOUT = 10 mA VIN = 3.0V, IOUT = 50 mA VIN = 3.0V, IOUT = 100 mA Sym Min Typ Max Unit s Conditions
(c) 2006 Microchip Technology Inc.
DS21989A-page 3
MCP1256/7/8/9
DC CHARACTERISTICS (CONTINUED)
Electrical Specifications: Unless otherwise indicated, all limits apply for VIN = 1.8V to 3.6V, SHDN = VIN, CIN = COUT = 10 F, C1 = C2 = 1 F, IOUT = 10 mA, TJ = -40C to +125C. Typical values are at TJ = +25C. Parameters Sym Min Typ Max Unit s Conditions
MCP1256 and MCP1257 Devices SLEEP Mode Input - SLEEP SLEEP Input Voltage Low SLEEP Input Voltage High SLEEP Input Leakage Current SLEEP Quiescent Current MCP1256 and MCP1258 Devices Power-Good Output - PGOOD PGOOD Threshold PGOOD Hysteresis PGOOD Output Low Voltage PGOOD Input Leakage Current MCP1257 and MCP1259 Low-Battery Output - LBO LBO Threshold LBO Hysteresis LBO Output Low Voltage LBO Input Leakage Current MCP1258 and MCP1259 BYPASS Mode Input - BYPASS BYPASS Input Voltage Low BYPASS Input Voltage High BYPASS Input Leakage Current BYPASS Quiescent Current BYPASS Input-to-Output Impedance VIL(BYPASS) VIH(BYPASS) ILK(BYPASS) IQ RBYPASS -- 1.4 -- -- -- -- -- 0.001 0.25 1.5 0.4 -- 0.1 2 -- V V A A VBYPASS = 0V, IOUT = 0 mA, TJ = +25C VIN = 2.4V VTH VHYS VOL ILK(LBO) -- -- -- -- 1.95 240 25 0.02 -- -- 100 1 V mV mV A VIN Falling VIN Rising ISINK = 0.5 mA, VIN = 1.8V VLBO = VIN VTH VHYS VOL ILK(PGOOD) -- -- -- -- 93 110 25 0.02 -- -- 100 1 % mV mV A Percent of VOUT Falling VOUT Rising ISINK = 0.5 mA, VIN = 1.8V VPGOOD = VIN VIL(SLEEP) VIH(SLEEP) ILK(SLEEP) IQ -- 1.4 -- -- -- -- 0.001 10 0.4 -- 0.1 20 V V A A VSLEEP = 0V, IOUT = 0 mA
DS21989A-page 4
(c) 2006 Microchip Technology Inc.
MCP1256/7/8/9
AC CHARACTERISTICS
Electrical Specifications: Unless otherwise indicated, all limits apply for VIN = 1.8V to 3.6V, SHDN = VIN, CIN = COUT = 10 F, C1 = C2 = 1 F, IOUT = 10 mA, TJ = -40C to +125C. Typical values are at TJ = +25C. Parameters ALL DEVICES Internal Oscillator Frequency Output Voltage Ripple, Normal Operation FOSC VRIP -- -- -- -- -- VOUT Wake-up Time From Shutdown TWKUP -- 650 5 20 12 55 175 -- -- -- -- -- -- kHz mVp-p mVp-p mVp-p mVp-p s COUT = 10 F, IOUT = 10 mA COUT = 10 F, IOUT = 100 mA COUT = 2.2 F, IOUT = 10 mA COUT = 2.2 F, IOUT = 100 mA VIN = 3.0V, IOUT = 10 mA, SHDN = VIH(MIN), VOUT from 0 to 90% Nominal Regulated Output Voltage COUT = 10 F, IOUT = 0.1 mA COUT = 10 F, IOUT = 4 mA COUT = 2.2 F, IOUT = 0.1 mA COUT = 2.2 F, IOUT = 4 mA VIN = 3.0V, IOUT = 10 mA, SHDN = VIH(MIN), VOUT from 0 to 90% Nominal Regulated Output Voltage Sym Min Typ Max Units Conditions
MCP1256 and MCP1257 Output Voltage Ripple, SLEEP Mode VRIP -- -- -- -- MCP1258 and MCP1259 VOUT Wake-up Time From BYPASS TWKUP -- 150 -- s 40 60 40 60 -- -- -- -- mVp-p mVp-p mVp-p mVp-p
TEMPERATURE SPECIFICATIONS
Electrical Specifications: Unless otherwise indicated, all limits apply for VIN = 1.8V to 3.6V, SHDN = VIN, CIN = COUT = 10 F, C1 = C2 = 1 F, IOUT = 10 mA, TJ = -40C to +125C. Typical values are at TJ = +25C. Parameters Temperature Ranges Specified Temperature Range Operating Temperature Range Storage Temperature Range Thermal Package Resistances Thermal Resistance, 10-Lead, MSOP Thermal Resistance, 10-Lead, DFN 3 mm x 3 mm JA JA -- -- 200 57 -- -- C/W C/W 4-Layer JC51-7 Standard Board, Natural Convection 4-Layer JC51-7 Standard Board, Natural Convection TJ TJ TA -40 -40 -65 -- -- -- +125 +125 +150 C C C Sym Min Typ Max Units Conditions
(c) 2006 Microchip Technology Inc.
DS21989A-page 5
MCP1256/7/8/9
2.0
Note:
TYPICAL PERFORMANCE CURVES
The graphs and tables provided following this note are a statistical summary based on a limited number of samples and are provided for informational purposes only. The performance characteristics listed herein are not tested or guaranteed. In some graphs or tables, the data presented may be outside the specified operating range (e.g., outside specified power supply range) and therefore outside the warranted range.
NOTE: Unless otherwise indicated, CIN = COUT = 10 F, C1 = C2 = 1 F, IOUT = 10 mA, and TA= +25C.
100 90 80 70 60 50 40 30 20 10 0 10
100 90 80 70 60 50 40 30 20 10 0 1.8 2.1 2.4
VIN = 1.8V VIN = 2.1V VIN = 2.4V VIN = 2.7V
Efficiency (%)
Efficiency (%)
IOUT = 25 mA
Mode Transition
30
50
70
90
110
130
2.7
3.0
3.3
Output Current (mA)
Input Voltage (V)
FIGURE 2-1: Current (IOUT).
90 80 70 60 50 40 30 20 10 0 10 30
Efficiency () vs. Output
FIGURE 2-4: Voltage (VIN).
100 90 80 70 60 50 40 30 20 10 0 1.8 2.1
Efficiency () vs. Supply
VIN = 2.7V VIN = 3.0V VIN = 3.3V
IOUT = 50 mA
Efficiency (%)
Efficiency (%)
Mode Transition
50
70
90
110
130
2.4
2.7
3.0
3.3
Output Current (mA)
Input Voltage (V)
FIGURE 2-2: Current (IOUT).
100 90 80 70 60 50 40 30 20 10 0 1.8 2.1
Efficiency () vs. Output
FIGURE 2-5: Voltage (VIN).
100 90 80 70 60 50 40 30 20 10 0 1.8 2.1
Efficiency () vs. Supply
Efficiency (%)
Efficiency (%)
IOUT = 10 mA
IOUT = 100 mA
Mode Transition
Mode Transition
2.4
2.7
3.0
3.3
2.4
2.7
3.0
3.3
Input Voltage (V)
Input Voltage (V)
FIGURE 2-3: Voltage (VIN).
Efficiency () vs. Supply
FIGURE 2-6: Voltage (VIN).
Efficiency () vs. Supply
DS21989A-page 6
(c) 2006 Microchip Technology Inc.
MCP1256/7/8/9
TYPICAL PERFORMANCE CURVES (CONTINUED)
NOTE: Unless otherwise indicated, CIN = COUT = 10 F, C1 = C2 = 1 F, IOUT = 10 mA, and TA= +25C.
3.5 Quiescent Supply Current (mA) Output Voltage (V) 3.4 3.3 3.2
VIN = 1.8V VIN = 3.6V VIN = 2.1V
2.4 2.2 2.0 1.8 1.6 1.4 1.2 0 10 20 30 40 50 60 70 80 90 100 Output Current (mA)
VIN = 2.4V
3.1 3.0 2.9 10 30 50 70 90 110 130 Output Current (mA)
FIGURE 2-7: Output Voltage (VOUT) vs. Output Current (IOUT).
3.5
FIGURE 2-10: Quiescent Supply Current (IQ) vs. Output Current (IOUT) - Normal Mode.
140 Quiescent Supply Current (A)
VIN = 2.4V
Output Voltage (V)
3.4 3.3 3.2 3.1 3.0 2.9 1.8
IOUT = 10 mA
120 100 80 60 40 20 0 0 0.2 0.4 0.6 0.8 1
IOUT = 50 mA IOUT = 100 mA
VIN = 3.0V
2.1
2.4
2.7
3.0
3.3
3.6
1.2 1.4 1.6 1.8
2
Input Voltage (V)
Output Current (mA)
FIGURE 2-8: Output Voltage (VOUT) vs. Input Voltage (VIN).
1.8 Quiescent Supply Current (mA)
FIGURE 2-11: Quiescent Supply Current (IQ) vs. Output Current (IOUT) - SLEEP Mode.
0.8 Quiescent Supply Current (mA) 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0 0 2 4 6 8 10 12 14 16 18 20 Output Current (mA)
VIN = 3.0V VIN = 2.4V
1.7 1.6 1.5 1.4 1.3 1.2 0 1 2 3 4 5 6 7 8 9 10 Output Current (mA)
VIN = 2.4V
FIGURE 2-9: Quiescent Supply Current (IQ) vs. Output Current (IOUT) - Normal Mode.
FIGURE 2-12: Quiescent Supply Current (IQ) vs. Output Current (IOUT) - SLEEP Mode.
(c) 2006 Microchip Technology Inc.
DS21989A-page 7
MCP1256/7/8/9
TYPICAL PERFORMANCE CURVES (CONTINUED)
NOTE: Unless otherwise indicated, CIN = COUT = 10 F, C1 = C2 = 1 F, IOUT = 10 mA, and TA= +25C.
2.0 Output Voltage Ripple (V) BYPASS Impedance () 1.8 1.6 1.4 1.2 1.0 1.8 2.1 2.4 2.7 3.0 3.3 3.6 Input Voltage (V) 0.04 0.03 0.02 0.01 0.00 -0.01 -0.02 -0.03 -0.04 0 1 2 3 4 5 6 7 8 9 10 Time (s)
VIN = 2.4V IOUT = 100 mA
FIGURE 2-13: BYPASS Impedance (RBYPASS) vs. Supply Voltage (VIN).
0.04 Output Voltage Ripple (V) 0.03 0.02 0.01 0.00 -0.01 -0.02 -0.03 -0.04 0 1 2 3 4 5 6 7 8 9 10 Time (s)
VIN = 2.4V IOUT = 10 mA
FIGURE 2-16: Output Voltage Ripple vs. Time - Normal 2x Mode.
0.04 Output Voltage Ripple (V) 0.03 0.02 0.01 0.00 -0.01 -0.02 -0.03 -0.04 0 1 2 3 4 5 6 7 8 9 10 Time (s)
VIN = 3.0V IOUT = 10 mA
FIGURE 2-14: Output Voltage Ripple vs. Time - Normal 2x Mode.
0.04 Output Voltage Ripple (V) 0.03 0.02 0.01 0.00 -0.01 -0.02 -0.03 -0.04 0 1 2 3 4 5 6 7 8 9 10 Time (s)
FIGURE 2-17: Output Voltage Ripple vs. Time - Normal 1.5x Mode.
0.04 Output Voltage Ripple (V) 0.03 0.02 0.01 0.00 -0.01 -0.02 -0.03 -0.04 0 1 2 3 4 5 6 7 8 9 10 Time (s)
VIN = 2.4V IOUT = 50 mA
VIN = 3.0V IOUT = 50 mA
FIGURE 2-15: Output Voltage Ripple vs. Time - Normal 2x Mode.
FIGURE 2-18: Output Voltage Ripple vs. Time - Normal 1.5x Mode.
DS21989A-page 8
(c) 2006 Microchip Technology Inc.
MCP1256/7/8/9
TYPICAL PERFORMANCE CURVES (CONTINUED)
NOTE: Unless otherwise indicated, CIN = COUT = 10 F, C1 = C2 = 1 F, IOUT = 10 mA, and TA= +25C.
0.04 Output Voltage Ripple (V) 0.03 0.02 0.01 0.00 -0.01 -0.02 -0.03 -0.04 0 1 2 3 4 5 6 7 8 9 10 Time (s) 0.20 0.15 0.10 0.05 0.00 -0.05 -0.10 -0.15 -0.20 0 100 200 300 400 500 600 700 800 900 900 0.20 0.00
VIN = 2.4V IOUT = 10 mA
VIN = 3.0V IOUT = 100 mA
Output Voltage Ripple (V)
VIN = 3.0V IOUT = 1 mA
Time (s)
FIGURE 2-19: Output Voltage Ripple vs. Time - Normal 1.5x Mode.
0.20 0.15 0.10 0.05 0.00 -0.05 -0.10 -0.15 -0.20 0 100 200 300 400 500 600 700 800 900 1000
FIGURE 2-22: Output Voltage Ripple vs. Time - SLEEP Mode.
0.20 0.15 0.10 0.05 0.00 -0.05 -0.10 -0.15 -0.20 0 100 200 300 400 500 600 700 800 1000
Output Voltage Ripple (V)
Output Voltage Ripple (V)
VIN = 2.4V IOUT = 1 mA
Time (s)
Output Voltage Ripple (V)
VIN = 3.0V IOUT = 10 mA
Time (s)
FIGURE 2-20: Output Voltage Ripple vs. Time - SLEEP Mode.
0.20 0.15 0.10 0.05 0.00 -0.05 -0.10 -0.15 -0.20 1000 0 100 200 300 400 500 600 700 800 900
FIGURE 2-23: Output Voltage Ripple vs. Time - SLEEP Mode.
8 SLEEP Input Voltage (V) 7 6 5 4 3 2 1 0 0 50 100 150 200 250 300 350 400 450 500
Output Voltage Ripple (V)
VIN = 2.4V IOUT = 10 mA
0.10 -0.10 -0.20 -0.30 -0.40 -0.50 -0.60
Time (s)
Time (s)
FIGURE 2-21: Output Voltage Ripple vs. Time - SLEEP Mode.
FIGURE 2-24: Output Voltage Ripple vs. Time - Mode Transition: SLEEP Mode-to-Normal 2x Mode-to-SLEEP Mode.
(c) 2006 Microchip Technology Inc.
DS21989A-page 9
1000
MCP1256/7/8/9
TYPICAL PERFORMANCE CURVES (CONTINUED)
NOTE: Unless otherwise indicated, CIN = COUT = 10 F, C1 = C2 = 1 F, IOUT = 10 mA, and TA= +25C.
0.40 Output Current (A) 0.35 0.30 0.25 0.20 0.15 0.10 0.05 0.00 0 50 100 150 200 250 300 350 400 450 500
IOUT VIN = 2.4V VOUT
0.20 Output Voltage Ripple (V) 0.10 0.00 -0.10 -0.20 -0.30 -0.40 -0.50 -0.60
Input Voltage (V)
8 7 6 5 4 3 2 1 0 0 50 100 150 200 250 300 350 400 450 500
VIN
IOUT = 10 mA
0.20
VOUT
0.00 -0.10 -0.20 -0.30 -0.40 -0.50 -0.60
Time (s)
Time (s)
FIGURE 2-25: Normal 2x Mode.
0.40 0.35 Output Current (A) 0.30 0.25 0.20 0.15 0.10 0.05 0.00 0 50 100 150
IOUT VOUT
Load Transient Response -
FIGURE 2-27:
Line Transient Response.
0.20 Output Voltage Ripple (V) 0.10 0.00
VIN = 3.0V
8 7 Input Voltage (V) 6 5 4 3 2 1 0 0 50 100 150 200 250 300 350 400 450 500
VIN VOUT
0.20 0.00
IOUT = 100 mA
-0.10 -0.20 -0.30 -0.40 -0.50 -0.60
-0.10 -0.20 -0.30 -0.40 -0.50 -0.60
200
250
300
350
400
450
500
Time (s)
Time (s)
FIGURE 2-26: Load Transient Response Normal 1.5x Mode.
FIGURE 2-28:
Line Transient Response.
DS21989A-page 10
(c) 2006 Microchip Technology Inc.
Output Voltage Ripple (V)
0.10
Output Voltage Ripple (V)
0.10
MCP1256/7/8/9
3.0 PIN DESCRIPTION
PIN FUNCTION TABLE
Symbol
PGOOD LBO 2 3 4 5 6 7 8 9 10 2 3 4 5 6 7 8 9 10 SLEEP BYPASS C2C1+ VOUT C2+ VIN C1GND SHDN
The descriptions of the pins are listed in Table 3-1.
TABLE 3-1:
Pin No. DFN
1
MSOP
1
Function
Power-Good Indication Open-Drain Output Pin: MCP1256 and MCP1258 Low-Battery Indication Open-Drain Output Pin: MCP1257 and MCP1259 Active Low SLEEP Mode Input Pin: MCP1256 and MCP1257 Active Low BYPASS Mode Input Pin: MCP1258 and MCP1259 Flying Capacitor Negative Pin Flying Capacitor Positive Pin Regulated 3.3V Output Voltage Flying Capacitor Positive Pin Power Supply Input Voltage Flying Capacitor Negative Pin 0V Reference Active Low SHUTDOWN Mode Input Pin
3.1
3.1.1
Status Indication (PGOOD, LBO)
POWER-GOOD OUTPUT PIN (PGOOD)
3.2.2
ACTIVE LOW BYPASS MODE (BYPASS)
MCP1256/8: PGOOD is high impedance when the output voltage is in regulation. A logic low is asserted when the output falls 7% (typical) below the nominal value. The PGOOD output remains low until VOUT is within 3% (typical) of its nominal value. On start-up, this pin indicates when the output voltage reaches its final value. PGOOD is high impedance when SHDN is low or when BYPASS is low (MCP1258).
MCP1258/9: A logic low signal applied to this pin places the device into a BYPASS mode of operation. In this mode, the input supply voltage is connected directly to the output.
3.3 3.4 3.5
Flying Capacitor Negative (C2-) Flying Capacitor Positive (C1+) Regulated Output Voltage (VOUT)
A 1 F ceramic flying capacitor is recommended.
A 1 F ceramic flying capacitor is recommended.
3.1.2
LOW-BATTERY OUTPUT PIN (LBO)
MCP1257/9: LBO is high impedance when the input voltage is above the low-battery threshold voltage. A logic low is asserted when the input falls below the lowbattery threshold voltage. The LBO output remains low until VIN is above the low-battery threshold voltage plus the low-battery hysteresis voltage. LBO is high impedance when SHDN is low or when BYPASS is low (MCP1259).
Regulated 3.3V output. Bypass to GND with a minimum of 2.2 F.
3.6 3.7
Flying Capacitor Positive (C2+) Power Supply Input Voltage (VIN)
A 1 F ceramic flying capacitor is recommended.
3.2
3.2.1
Mode Selection (SLEEP, BYPASS)
ACTIVE LOW SLEEP MODE (SLEEP)
A supply voltage of 1.8V to 3.6V is recommended. Bypass to GND with a minimum of 1 F.
3.8 3.9 3.10
Flying Capacitor Negative (C1-) 0V Reference (GND) Device Shut Down (SHDN)
MCP1256/7: A logic low signal applied to this pin places the device into a SLEEP mode of operation. In this mode, the device maintains regulation. SLEEP mode performs pulse skip operation reducing the current draw of the device at the expense of increased output voltage ripple.
A 1 F ceramic flying capacitor is recommended.
Connect to negative terminal of and input supply.
A logic low signal applied to this pin disables the device. A logic high signal applied to this pin allows normal operation.
(c) 2006 Microchip Technology Inc. DS21989A-page 11
MCP1256/7/8/9
4.0 DEVICE OVERVIEW
The MCP1256/7/8/9 devices are positive regulated charge pumps that accept an input voltage from +1.8V to +3.6V and convert it to a regulated 3.3V output voltage. The MCP1256/7/8/9 provide a low-cost, compact and simple solution for step-up DC/DC conversions, primarily in battery applications, that do not want to use switching regulator solutions because of EMI noise and inductor size. The MCP1256/7/8/9 are designed to offer the highest possible efficiency under common operating conditions, i.e. VIN = 2.4V or 2.8V, VOUT = 3.3V, IOUT = 100 mA. A fixed switching frequency, 650 kHz typically, allows for easy external filtering. The MCP1256/7 provide a unique SLEEP mode feature which reduces the current drawn from the input supply while maintaining a regulated bias on external peripherals. SLEEP mode can substantially increase battery run-time in portable applications. The MCP1258/9 provide a unique BYPASS mode feature which virtually eliminates the current drawn from the input supply by the device while maintaining an unregulated bias on external peripherals. BYPASS connects the input supply voltage to the output. All remaining functions of the device are shutdown. BYPASS mode can substantially increase battery runtime in portable applications. The devices supply up to 100 mA of output current for input voltages, VIN, greater than or equal to 2.2V. The devices are available in small 10-Pin MSOP or DFN packages with an operating junction temperature range of -40C to +125C. (2x mode), when the energy is transferred to the output. The transfer mode determines which switches are closed for the transfer. Both phases occur in one clock period of the internal oscillator. When the second phase (transfer) has been completed, the cycle repeats.
4.2
Power Efficiency
The power efficiency, , is determined by the mode of operation, 1.5x mode or 2x mode. Equation 4-1 and Equation 4-2 are used to approximate the power efficiency with any significant amount of output current. At light loads, the device quiescent current must be taken into consideration.
EQUATION 4-1:
VOUT x I OUT V OUT P OUT 1.5x = ------------- = ---------------------------------------- = --------------------PIN VIN x 1.5 x I OUT VIN x 1.5
EQUATION 4-2:
POUT VOUT x I OUT V OUT 2x = ------------- = ------------------------------------ = ----------------P IN V IN x 2 x I OUT VIN x 2
4.3
Shutdown Mode (SHDN)
Driving SHDN low places the MCP1256/7/8/9 in a lowpower Shutdown mode. This disables the charge-pump switches, oscillator and control logic, reducing the quiescent current to 0.25 A (typical). The PGOOD output and LBO are in a high impedance state during shutdown.
4.1
Theory of Operation
4.4
SLEEP Mode (SLEEP)
The MCP1256/7/8/9 devices employ a switched capacitor charge pump to boost an input supply, VIN, to a regulated 3.3V output voltage. Refering to the Functional Block Diagram, the devices perform conversion and regulation in two phases: charge and transfer. When the devices are not in shutdown, SLEEP or BYPASS, the two phases are continuously cycled through. Charge transfers charge from the input supply to the flying capacitors, C1 and C2, connected to pins C1+, C1-, C2+ and C2-, respectively. During this phase, switches S4 and S6 are closed. Switch S2 controls the amount of charge transferred to the flying capacitors. The amount of charge is determined by a sample and hold error amplifier with feedback from the output voltage at the beginning of the phase. Once the first phase (charge) is complete, transfer is initiated. The second phase transfers the energy from the flying capacitors to the output. The MCP1256/7/8/9 devices autonomously switch between 1.5x mode and 2x mode. This determines whether the flying capacitors are placed in parallel (1.5x mode), or remain in series
The MCP1256/7 provide a unique SLEEP mode feature. SLEEP mode reduces the current drawn from the input supply while maintaining a regulated bias on external peripherals. SLEEP mode can substantially increase battery run-time in portable applications. The regulation control is referred to as a bang-bang control due to the output being regulated around a fixed reference with some hysteresis. As a result, some amount of peak-to-peak ripple will be observed at the output independent of load current. The frequency of the output ripple, however, will be influenced heavily by the load current and output capacitance.
4.5
BYPASS Mode (BYPASS)
The MCP1258/9 provide a unique BYPASS mode feature which virtually eliminates the current drawn from the input supply by the device, while maintaining an unregulated bias on external peripherals. BYPASS connects the input supply voltage to the output. All remaining functions of the device are shutdown. BYPASS mode can substantially increase battery runtime in portable applications.
DS21989A-page 12
(c) 2006 Microchip Technology Inc.
MCP1256/7/8/9
4.6 Power-Good Output (PGOOD) 4.9 Thermal Shutdown
For the MCP1256/8 devices, the PGOOD output is an open-drain output that sinks current when the regulator output voltage falls below 0.93VOUT (typical). If the regulator output voltage falls below 0.93VOUT (typical) for less than 200 s and then recovers, glitch immunity circuits prevent the PGOOD signal from transitioning low. A 10 k to 1 M pull-up resistor from PGOOD to VOUT may be used to provide a logic output. If not used, connect PGOOD to GND or leave unconnected. PGOOD is high impedance when the output voltage is in regulation. A logic low is asserted when the output falls 7% (typical) below the nominal value. The PGOOD output remains low until VOUT is within 3% (typical) of its nominal value. On start-up, this pin indicates when the output voltage reaches its final value. PGOOD is high impedance when SHDN is low or when BYPASS is low (MCP1258). The MCP1256/7/8/9 devices feature thermal shutdown with temperature hysteresis. When the die temperature exceeds 160C, the device shuts down. When the die cools by 15C, the MCP1256/7/8/9 automatically turns back on again. If high die temperature is caused by output overload and the load is not removed, the device will turn on and off resulting in a pulsed output.
5.0
5.1
APPLICATIONS
Capacitor Selection
4.7
Low-Battery Output (LBO)
For the MCP1257/9 devices, the LBO output is an open-drain output that sinks current when the input voltage falls below a preset threshold. If the input voltage falls below the preset threshold for less than 200 s and then recovers, glitch immunity circuits prevent the LBO signal from transitioning low. A 10 k to 1 M pull-up resistor from LBO to VOUT may be used to provide a logic output. If not used, connect LBO to GND or leave unconnected. LBO is high impedance when the input voltage is above the low-battery threshold voltage. A logic low is asserted when the input falls below the low-battery threshold voltage. The LBO output remains low until VIN is above the low-battery threshold voltage plus the low-battery hysteresis voltage. LBO is high impedance when SHDN is low or when BYPASS is low (MCP1259).
The style and value of capacitors used with the MCP1256/7/8/9 family determine several important parameters, such as output voltage ripple and charge pump strength. To minimize noise and ripple, it is recommended that low ESR (0.1) capacitors be used for both CIN and COUT. These capacitors should be ceramic and should be 10 F or higher for optimum performance. If the source impedance to VIN is very low, up to several megahertz, CIN may not be required. Alternatively, a somewhat smaller value of CIN may be substituted for the recommended 10 F, but will not be as effective in preventing ripple on the VIN pin. The value of COUT controls the amount of output voltage ripple present on VOUT. Increasing the size of COUT will reduce output ripple at the expense of a slower turn-on time from shutdown and a higher inrush current. The flying capacitors (C1 and C2) control the strength of the charge pump and in order to achieve the maximum rated output current (100 mA), it is necessary to have at least 1 F of capacitance for the flying capacitor. A smaller flying capacitor delivers less charge per clock cycle to the output capacitor resulting in lower available output current.
4.8
Soft-Start and Short-Circuit Protection
5.2
PCB Layout Issues
The MCP1256/7/8/9 devices feature fold back shortcircuit protection. This circuitry provides an internal soft-start function by limiting inrush current during startup and also limits the output current to 150 mA (typical), if the output is short-circuited to GND. The internal soft-start circuitry requires approximately 175 s, typical, from either initial power-up, release from Shutdown, or release from BYPASS (MCP1258/9) for the output voltage to be in regulation.
The MCP1256/7/8/9 devices transfer charge at high switching frequencies producing fast, high peak, transient currents. As a result, any stray inductance in the component layout will produce unwanted noise in the system. Proper board layout techniques are required to ensure optimum performance.
(c) 2006 Microchip Technology Inc.
DS21989A-page 13
MCP1256/7/8/9
6.0 TYPICAL APPLICATION CIRCUITS
The MCP1256/7/8/9 devices are inductorless, positive regulated, switched capacitor DC/DC converters. Typical application circuits are depicted in Figure 6-1.
INPUT 1.8V to 3.6V CIN 10 F
MCP1256 7 VIN VOUT 5 R1 10 4 C1 1 F 8 2 ON / OFF SHDN C1 + C1 SLEEP GND 9 PGOOD C2 + C21 6 3 C2 1 F COUT 10 F
OUTPUT 3.3V
Power-Good Indication
Typical Application with Power-Good Indication
INPUT 1.8V to 3.6V CIN 10 F
MCP1259 7 VIN VOUT 5 COUT R1 10 4 C1 1 F 8 2 ON / OFF SHDN C1 + C1 BYPASS GND 9 LBO C2 + C2 1 6 3 C2 1 F 10 F
OUTPUT 3.3V
Low-Battery Indication
Typical Application with Low-Battery Indication
FIGURE 6-1:
Typical Application Circuits.
DS21989A-page 14
(c) 2006 Microchip Technology Inc.
MCP1256/7/8/9
7.0
7.1
PACKAGING INFORMATION
Package Marking Information
10-Lead DFN
1 2 3 4 5 10
Example:
1 2 3 4 5 10
XXXX XYWW NNN
9 8 7 6
1256 E607 256
9 8 7 6
10-Lead MSOP
Example:
XXXXX YWWNNN
1259E 607256
Legend: XX...X Y YY WW NNN
e3
* Note:
Customer-specific information Year code (last digit of calendar year) Year code (last 2 digits of calendar year) Week code (week of January 1 is week `01') Alphanumeric traceability code Pb-free JEDEC designator for Matte Tin (Sn) This package is Pb-free. The Pb-free JEDEC designator ( e3 ) can be found on the outer packaging for this package.
In the event the full Microchip part number cannot be marked on one line, it will be carried over to the next line, thus limiting the number of available characters for customer-specific information.
(c) 2006 Microchip Technology Inc.
DS21989A-page 15
MCP1256/7/8/9
10-Lead Plastic Dual-Flat No-Lead Package (MF) 3x3x0.9 mm Body (DFN) - Saw Singulated
E
b
p n L
K D D2
PIN 1 ID INDEX AREA (NOTE 1)
EXPOSED METAL PAD (NOTE 2)
2 E2
1
TOP VIEW
A EXPOSED TIE BAR (NOTE 3)
BOTTOM VIEW
A3
A1
Units Dimension Limits Number of Pins Pitch Overall Height Standoff Lead Thickness Overall Length Exposed Pad Length Overall Width Exposed Pad Width Lead Width Contact Length Contact-to-Exposed Pad (Note 3) (Note 3) n e A A1 A3 E E2 D D2 b L K .112 .082 .112 .051 .008 .012 .008 .031 .000 MIN
INCHES NOM 10 .020 BSC .035 .001 .008 REF. .118 .094 .118 .065 .010 .016 -- .124 .096 .124 .067 .015 .020 -- 2.85 2.08 2.85 1.30 0.18 0.30 0.20 .039 .002 0.80 0.00 MAX MIN
MILLIMETERS* NOM 10 0.50 BSC 0.90 0.02 0.20 REF. 3.00 2.39 3.00 1.65 0.25 0.40 -- 3.15 2.45 3.15 1.70 0.30 0.50 -- 1.00 0.05 MAX
* Controlling Parameter Significant Characteristic Notes: 1. Pin 1 visual index feature may vary, but must be located within the hatched area. 2. Exposed pad varies according to die attach paddle size. 3. Package may have one or more exposed tie bars at ends. BSC: Basic Dimension. Theoretically exact value shown without tolerances. See ASME Y14.5M REF: Reference Dimension, usually without tolerance, for information purposes only. See ASME Y14.5M JEDEC equivalent: Not Registered Drawing No. C04-063
Revised 09-12-05
DS21989A-page 16
(c) 2006 Microchip Technology Inc.
MCP1256/7/8/9
10-Lead Plastic Micro Small Outline Package (UN) (MSOP)
E E1
p D 2 B n 1
c
A
A2
L (F)
A1
Number of Pins Pitch Overall Height
Units Dimension Limits n p A A2 A1 E E1 D L F c B
MIN
INCHES NOM 10 .020 BSC
MAX
MIN
MILLIMETERS* NOM 10 0.50 BSC
MAX
.043 .030 .000 .193 BSC .118 BSC .118 BSC .016 0 .003 .006 5 5 .024 .037 REF - - .009 - - .031 8 .009 .012 15 15 .033 .037 .006
- 0.75 0.00 4.90 BSC 3.00 BSC 3.00 BSC 0.40 0 0.08 0.15 5 5
- 0.85
1.10 0.95 0.15
Molded Package Thickness Standoff Overall Width Molded Package Width Overall Length Foot Length Footprint Foot Angle Lead Thickness Lead Width Mold Draft Angle Top Mold Draft Angle Bott om
0.60 0.95 REF - - 0.23 - -
0.80 8 0.23 0.30 15 15
* Controlling Parameter Notes: Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010" (0.254 mm) per side. BSC: Basic Dimension. Theoretically exact value shown without tolerances. See ASME Y14.5M REF: Reference Dimesion, usually witho ut tolerance, for information purposes only. n See ASME Y14.5M JEDEC Equivalent: MO-187 BA Revised 09-16-05 Drawing No. C04-021
(c) 2006 Microchip Technology Inc.
DS21989A-page 17
MCP1256/7/8/9
NOTES:
DS21989A-page 18
(c) 2006 Microchip Technology Inc.
MCP1256/7/8/9
APPENDIX A: REVISION HISTORY
Revision A (March 2006)
* Original Release of this Document.
(c) 2006 Microchip Technology Inc.
DS21989A-page 19
MCP1256/7/8/9
NOTES:
DS21989A-page 20
(c) 2006 Microchip Technology Inc.
MCP1256/7/8/9
PRODUCT IDENTIFICATION SYSTEM
To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office. PART NO. Device X Temperature Range /XX Package Examples:
a) b) c) d) Device MCP1256: MCP1256T: MCP1257: MCP1257T: MCP1258: MCP1258T: MCP1259: MCP1259T: Positive Regulated Charge Pump with SLEEP Mode and Power-Good Indication Positive Regulated Charge Pump with SLEEP Mode and Power-Good Indication, Tape and Reel Positive Regulated Charge Pump with SLEEP Mode and Low-Battery Indication Positive Regulated Charge Pump with SLEEP Mode and Low-Battery Indication, Tape and Reel Positive Regulated Charge Pump with BYPASS Mode and Power-Good Indication Positive Regulated Charge Pump with BYPASS Mode and Power-Good Indication, Tape and Reel Positive Regulated Charge Pump with BYPASS Mode and Low-Battery Indication Positive Regulated Charge Pump with BYPASS Mode and Low -Battery Indication, Tape and Reel MCP1256-EMF: MCP1256T-EMF: MCP1256-EUN: MCP1256T-EUN: E-Temp, DFN package Tape and Reel, E-Temp, DFN package E-Temp, MSOP package Tape and Reel, E-Temp, MSOP package
a) b) c) d)
MCP1257-EMF: MCP1257T-EMF: MCP1257-EUN: MCP1257T-EUN:
E-Temp, DFN package Tape and Reel, E-Temp, DFN package E-Temp, MSOP package Tape and Reel, E-Temp, MSOP package
a) b) c) d)
MCP1258-EMF: MCP1258T-EMF: MCP1258-EUN: MCP1258T-EUN:
E-Temp, DFN package Tape and Reel, E-Temp, DFN package E-Temp, MSOP package Tape and Reel, E-Temp, MSOP package
a) b) c) d)
MCP1259-EMF: MCP1259T-EMF: MCP1259-EUN: MCP1259T-EUN:
Temperature Range Package
E MF UN
= -40C to +125C = Dual Flat, No Lead (3x3 mm body), 10-Lead = Plastic Micro Small Outline (MSOP), 10-Lead
E-Temp, DFN package Tape and Reel, E-Temp, DFN package E-Temp, MSOP package Tape and Reel, E-Temp, MSOP package
(c) 2006 Microchip Technology Inc.
DS21989A-page 21
MCP1256/7/8/9
NOTES:
DS21989A-page 22
(c) 2006 Microchip Technology Inc.
Note the following details of the code protection feature on Microchip devices: * * * Microchip products meet the specification contained in their particular Microchip Data Sheet. Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the intended manner and under normal conditions. There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip's Data Sheets. Most likely, the person doing so is engaged in theft of intellectual property. Microchip is willing to work with the customer who is concerned about the integrity of their code. Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not mean that we are guaranteeing the product as "unbreakable."
* *
Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our products. Attempts to break Microchip's code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act.
Information contained in this publication regarding device applications and the like is provided only for your convenience and may be superseded by updates. It is your responsibility to ensure that your application meets with your specifications. MICROCHIP MAKES NO REPRESENTATIONS OR WARRANTIES OF ANY KIND WHETHER EXPRESS OR IMPLIED, WRITTEN OR ORAL, STATUTORY OR OTHERWISE, RELATED TO THE INFORMATION, INCLUDING BUT NOT LIMITED TO ITS CONDITION, QUALITY, PERFORMANCE, MERCHANTABILITY OR FITNESS FOR PURPOSE. Microchip disclaims all liability arising from this information and its use. Use of Microchip devices in life support and/or safety applications is entirely at the buyer's risk, and the buyer agrees to defend, indemnify and hold harmless Microchip from any and all damages, claims, suits, or expenses resulting from such use. No licenses are conveyed, implicitly or otherwise, under any Microchip intellectual property rights.
Trademarks The Microchip name and logo, the Microchip logo, Accuron, dsPIC, KEELOQ, microID, MPLAB, PIC, PICmicro, PICSTART, PRO MATE, PowerSmart, rfPIC, and SmartShunt are registered trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. AmpLab, FilterLab, Migratable Memory, MXDEV, MXLAB, PICMASTER, SEEVAL, SmartSensor and The Embedded Control Solutions Company are registered trademarks of Microchip Technology Incorporated in the U.S.A. Analog-for-the-Digital Age, Application Maestro, dsPICDEM, dsPICDEM.net, dsPICworks, ECAN, ECONOMONITOR, FanSense, FlexROM, fuzzyLAB, In-Circuit Serial Programming, ICSP, ICEPIC, Linear Active Thermistor, MPASM, MPLIB, MPLINK, MPSIM, PICkit, PICDEM, PICDEM.net, PICLAB, PICtail, PowerCal, PowerInfo, PowerMate, PowerTool, Real ICE, rfLAB, rfPICDEM, Select Mode, Smart Serial, SmartTel, Total Endurance, UNI/O, WiperLock and Zena are trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. SQTP is a service mark of Microchip Technology Incorporated in the U.S.A. All other trademarks mentioned herein are property of their respective companies. (c) 2006, Microchip Technology Incorporated, Printed in the U.S.A., All Rights Reserved. Printed on recycled paper.
Microchip received ISO/TS-16949:2002 quality system certification for its worldwide headquarters, design and wafer fabrication facilities in Chandler and Tempe, Arizona and Mountain View, California in October 2003. The Company's quality system processes and procedures are for its PICmicro(R) 8-bit MCUs, KEELOQ(R) code hopping devices, Serial EEPROMs, microperipherals, nonvolatile memory and analog products. In addition, Microchip's quality system for the design and manufacture of development systems is ISO 9001:2000 certified.
(c) 2006 Microchip Technology Inc.
DS21989A-page 23
WORLDWIDE SALES AND SERVICE
AMERICAS
Corporate Office 2355 West Chandler Blvd. Chandler, AZ 85224-6199 Tel: 480-792-7200 Fax: 480-792-7277 Technical Support: http://support.microchip.com Web Address: www.microchip.com Atlanta Alpharetta, GA Tel: 770-640-0034 Fax: 770-640-0307 Boston Westborough, MA Tel: 774-760-0087 Fax: 774-760-0088 Chicago Itasca, IL Tel: 630-285-0071 Fax: 630-285-0075 Dallas Addison, TX Tel: 972-818-7423 Fax: 972-818-2924 Detroit Farmington Hills, MI Tel: 248-538-2250 Fax: 248-538-2260 Kokomo Kokomo, IN Tel: 765-864-8360 Fax: 765-864-8387 Los Angeles Mission Viejo, CA Tel: 949-462-9523 Fax: 949-462-9608 San Jose Mountain View, CA Tel: 650-215-1444 Fax: 650-961-0286 Toronto Mississauga, Ontario, Canada Tel: 905-673-0699 Fax: 905-673-6509
ASIA/PACIFIC
Australia - Sydney Tel: 61-2-9868-6733 Fax: 61-2-9868-6755 China - Beijing Tel: 86-10-8528-2100 Fax: 86-10-8528-2104 China - Chengdu Tel: 86-28-8676-6200 Fax: 86-28-8676-6599 China - Fuzhou Tel: 86-591-8750-3506 Fax: 86-591-8750-3521 China - Hong Kong SAR Tel: 852-2401-1200 Fax: 852-2401-3431 China - Qingdao Tel: 86-532-8502-7355 Fax: 86-532-8502-7205 China - Shanghai Tel: 86-21-5407-5533 Fax: 86-21-5407-5066 China - Shenyang Tel: 86-24-2334-2829 Fax: 86-24-2334-2393 China - Shenzhen Tel: 86-755-8203-2660 Fax: 86-755-8203-1760 China - Shunde Tel: 86-757-2839-5507 Fax: 86-757-2839-5571 China - Wuhan Tel: 86-27-5980-5300 Fax: 86-27-5980-5118 China - Xian Tel: 86-29-8833-7250 Fax: 86-29-8833-7256
ASIA/PACIFIC
India - Bangalore Tel: 91-80-4182-8400 Fax: 91-80-4182-8422 India - New Delhi Tel: 91-11-5160-8631 Fax: 91-11-5160-8632 India - Pune Tel: 91-20-2566-1512 Fax: 91-20-2566-1513 Japan - Yokohama Tel: 81-45-471- 6166 Fax: 81-45-471-6122 Korea - Gumi Tel: 82-54-473-4301 Fax: 82-54-473-4302 Korea - Seoul Tel: 82-2-554-7200 Fax: 82-2-558-5932 or 82-2-558-5934 Malaysia - Penang Tel: 60-4-646-8870 Fax: 60-4-646-5086 Philippines - Manila Tel: 63-2-634-9065 Fax: 63-2-634-9069 Singapore Tel: 65-6334-8870 Fax: 65-6334-8850 Taiwan - Hsin Chu Tel: 886-3-572-9526 Fax: 886-3-572-6459 Taiwan - Kaohsiung Tel: 886-7-536-4818 Fax: 886-7-536-4803 Taiwan - Taipei Tel: 886-2-2500-6610 Fax: 886-2-2508-0102 Thailand - Bangkok Tel: 66-2-694-1351 Fax: 66-2-694-1350
EUROPE
Austria - Wels Tel: 43-7242-2244-399 Fax: 43-7242-2244-393 Denmark - Copenhagen Tel: 45-4450-2828 Fax: 45-4485-2829 France - Paris Tel: 33-1-69-53-63-20 Fax: 33-1-69-30-90-79 Germany - Munich Tel: 49-89-627-144-0 Fax: 49-89-627-144-44 Italy - Milan Tel: 39-0331-742611 Fax: 39-0331-466781 Netherlands - Drunen Tel: 31-416-690399 Fax: 31-416-690340 Spain - Madrid Tel: 34-91-708-08-90 Fax: 34-91-708-08-91 UK - Wokingham Tel: 44-118-921-5869 Fax: 44-118-921-5820
02/16/06
DS21989A-page 24
(c) 2006 Microchip Technology Inc.

▲Up To Search▲

Price & Availability of MCP1256

	To Download MCP1256 Datasheet File
If you can't view the Datasheet, Please click here to try to view without PDF Reader .